Hanic Propels Malaysia’s Semiconductor Value Chain with New IC Design and Advanced Packaging Hub in Penang

Source: InvestPenang

The expansion is expected to create over 60 high-value engineering jobs in the near future, focusing on digital and analog designs, design verifications, physical designs and advanced 2.5D/3D packaging designs.

The Right Honourable Chief Minister of Penang, Mr. Chow Kon Yeow, stated, ““Building on five decades of industrial excellence, Penang continues to strengthen its position as the Silicon Valley of the East by advancing into next-generation technologies. Hanic’s investment in IC Design and Advanced Packaging Design aligns strongly with Malaysia’s National Semiconductor Strategy to deepen front-end design capabilities and enhance advanced packaging competencies.” He added, “Through initiatives such as Penang Silicon Design @5KM+ (PSD@5KM+), we are building an integrated ecosystem that connects design, testing and manufacturing. Hanic’s presence will further enhance our innovation capacity, create high-value talent opportunities, and generate positive technological spillovers for the state.”

Dr Oh Ser Wah, General Manager of Hanic, commented, “Penang offers a unique synergy of decades-long electronics manufacturing excellence and a burgeoning design ecosystem. With Hanic’s strong track records including delivering the first 3D IC for a major country in this region, our expansion here is a strategic move to be at the heart of the semiconductor revolution. With the support of InvestPenang, Hanic is committed to nurturing local talent and pioneering innovations in IC design and advanced packaging that will define the next decade of computing performance.”

Hanic’s Penang office is currently ramping up hiring across multiple domains in system-on-chip (SoC) designs, design verifications, physical designs, design-for-test (DFT) and advanced packaging designs. At the same time, Hanic is also in discussion with various partners to define the roadmap for advanced packaging.